Many of these techniques used for metal deposition can be used to deposit other materials as well. A threshold energy for the release of an atom from the target exists, below which the atom is not sputtered. Sputter deposition is a physical vapor deposition pvd method of thin film deposition by sputtering. What is sputtering deposition deposition technology. Thin film deposition 34 for a rf sputtering than in a dc sputtering 19. Pdf directional copper deposition using dc magnetron self. The sputtering gas pressure can impact on film deposition parameters, such as deposition rate and composition of the film. Handbook of sputter deposition technology 2nd edition. Nov 01, 20 sputtering deposition film growth the sputter atoms have. Tron sputtering is a widely used technique which is affected by. Pdf directional copper deposition using dc magnetron. Resputtering is reemission of the deposited material during the deposition process by ion or atom bombardment. Sputtering is a technique used to deposit thin films of a material onto a surface a.
Deposition of nonconductive materials, however, requires a different power delivery system. Sputtering is highly versatile vacuum coating system which is used for deposition of various coating materials. Below is a brief description outlining the differences between these power types. Zno films deposited on porous silicon by dc sputtering.
Radio frequency rf power can be used for sputter deposition of insulating target materials, and pulsed dc power can be used for reactive sputter deposition of insulating materials from a conductive metal target. Magnetron sputtering unbalanced magnetron balanced magnetron 3. Handbook of physical vapor deposition pvd processing second edition, 2010 related terms. Handbook of sputter deposition technology 2nd edition fundamentals and applications for functional thin films, nanomaterials and mems. Rf sputtering can be used for the coating of dielectric or insulative materials that can take on a charge that results in arcing in the vacuum chamber with convention dc sputtering. Sputter deposition an overview sciencedirect topics. Hv or uhv rf dc pulsed dc compatible magnetron sputtering system.
In situ substrate to target distance adjustment upto 100 mm in order to achieve desired uniformity and deposition rate. Introduction during the last decade the dc and rf sputteri ng techniques have been used extensively in their two configurations balanced and unbalanced magnetron. Influence of the substrate temperature on structure, compostion and morphology of the film, surface and coatings technology, vol 88. Difference between rf sputtering and dc sputtering rf. Sputter deposition is a widely used physical vapor deposition method and has advantages over techniques such as pulsed laser deposition or molecular beam epitaxy when it comes to making largearea films for numerous industrial applications. Best oxide films are obtained just below this critical point. Reactive dc magnetron sputtering of ultrathin superconducting. Dc power is generally used with electrically conductive target materials.
Magnetron sputtering is a plasma vapor deposition pvd process in which a plasma is created and positively charged ions from the plasma are accelerated by an electrical field superimposed on the negatively charged electrode or target. Magnetron sputtering, in particular, shows how the application of simple physical principles has led to a successful commercial technology. Dc plasma power supply for a sputter deposition of material layers on a substrate includes a plasma controller and a plasma input for the settings of the output voltage and output current providing plasma ignition and termination with no arcing and no striking voltage. Pvd rf sputtering coating principle magnetron sputter. Dc magnetron sputtering deposition of titanium oxide nanoparticles. Thus, this type of sputtering is known as rf sputtering, figure 2.
The work presented in chapter 5 of this thesis on nige multilayer was prepared by dc rf magnetron sputtering. Study of plasma and ion beam sputtering processes 129 of an ion source for a particular application should be made with due consideration of factors such as species and intensity capability, beam quality emittance and brightness, ionization efficiency, reliability. The main difference between this and a basic dc sputtering system described above is the addition of a strong magnetic field near the target area. From the search in the patent database, it can be concluded that sputter deposition is still the most popular technique. Dc sputtering has a wider range of application and is suitable for all the materials for conductive and nonconductive materials. A type of physical vapor deposition pvd coating technology, magnetron sputtering is a plasmabased coating process where a magnetically confined plasma is created near the surface of a target material. The deposition was performed at room temperature, and the samples were annealed afterwards to improve the zno crystalline quality. However, sputtering yield variations are smaller compared to vapor pressure variations. Magnetron sputtering deposition systems denton vacuum. Dc reactive magnetron sputtering was used to deposit fewnanometerthick films of niobium nitride for fabrication of superconducting devices. Mod01 lec17 radio frequency and pulsed dc sputtering.
Beyond a critical gas pressure, it progresses rapidly. Sputtering deposition film growth the sputter atoms have. The sputter yield ratio of target atoms expelled to incident atoms impinging on the target increases with increasing energy plasma power or dc bias. Dc sputtering vs rf sputtering the comparison of dc. Dc magnetron sputtering deposition of titanium oxide. High quality ito thin films grown by dc and rf sputtering. By first creating a gaseous plasma and then accelerating the ions from this plasma into some source material a. Magnetron sputtering overview deposition equipment. Cathodic arc deposition sputtering evaporation magnetron ion beam diode triode reactive sputter deposition arc ebeam inductive resistive rf radio frequency dc direct current mep magnetically enhanced plasma ubms unbalanced magnetron sputtering dms dual magnetron sputtering hipimshppms highpower impulsepulse magnetron sputtering figure 1. Us6447655b2 dc plasma power supply for a sputter deposition. A dc magnetron sputtering apparatus for depositing a film on a substrate comprising.
Effects of energetic ion bombardment on structural and. Reactive dc magnetron sputtering of ultrathin superconducting niobium nitride films by andrew e. Sputtering physical vapour deposition pvd coatings. Application data collected has shown that a high quality well designed rotary pumped magnetron sputter coater, such as the quorum k550x, is capable of producing a continuous pt platinum film with a grain size in the order of 2 nm. Among these is a process called sputtering that has. Rf plasmas tend to fill the chamber as opposed to dc plasmas which are confined to the cathode. Finally, the sputtering technique can increase the rate of.
The sputtering method of thin film deposition involves introducing a controlled gas, usually chemically inert argon, into a vacuum chamber, and electrically energizing a cathode to establish a self sustaining plasma. Magnetron sputtering s swann sputtering, once no more than a scientific curiosity, is increasingly widely used to produce thin coatings. The work presented in chapter 5 of this thesis on nige multilayer was prepared by dcrf magnetron sputtering. There are several types of power supplies used in magnetron sputtering, these include dc, rf, pulsed dc, mf ac, and hipims. In order to avoid any chemical reaction between the sputtered atoms and the sputtering gas, the sputtering gas is usually an inert gas, such as argon. Nov 26, 2016 dc or direct current sputtering is a thin film physical vapor deposition pvd coating technique where a target material to be used as the coating is bombarded with ionized gas molecules causing atoms to be sputtered off into the plasma.
The sputtering gas pressure can impact on film deposition parameters, such as deposition rate and composition. Magnetron sputtering technology basic sputtering process there are many different ways to deposit materials such as metals, ceramics, and plastics onto a surface substrate and to form a thin film. Sputtering only happens when the kinetic energy of the incoming particles is much higher than conventional thermal energies. However, rf sputtering deposition rates are slower than dc sputtering rates and have higher power costs and so is usually used on smaller substrates to be coated. Rfdc magnetron sputtering system apt advanced process. This page compares rf sputtering vs dc sputtering and mentions difference between rf sputtering and dc sputtering. Difference between rf sputtering and dc sputtering rf sputtering vs dc sputtering. Over samples were deposited on a variety of substrates, under various chamber conditions. Handbook of physical vapor deposition pvd processing second edition, 2010.
This can be overcome by making the target area small compared to the substrate. Several methods are currently used for deposition of metal layers. Plasma gas is used ti knock atoms out of the target. Also, since temperatures are lower and melting is not an. During the deposition, the substrate temperature was maintained with the pressure. Magnetron sputtering physical vapor deposition systems. However, in some applications, such as the deposition of oxides and nitrides, a reactive gas is purposely added to argon so that the deposited. A directional copper deposition process has been developed that uses a dc magnetron source operating in selfsputtering mode.
Normally both the target and substrate should sputter. Magnetron sputtering magnetron sputtering is the most commonly used method for a sputter deposition. Cathodic arc deposition sputtering evaporation magnetron ion beam diode triode reactive sputter deposition arc ebeam inductive resistive rf radio frequency dc direct current mep magnetically enhanced plasma ubms unbalanced magnetron sputtering dms dual magnetron sputtering hipimshppms highpower impulsepulse magnetron. Organized into three parts for ease of use, this handbook introduces the fundamentals of thin films and sputtering deposition, explores the theory and practices of this field. Evaporation and sputtering metalization for all devices, there is a need to go from semiconductor to metal. Dc sputtering is a simple technique and suitable for conductive materials only. Magnetron sputtering is a highly versatile thin film deposition technique for coating films with excellent adhesion and high density. Magnetron sputtering is a deposition technology involving a gaseous plasma which is generated and confined to a space containing the material to be deposited the target. Deposition method dc magnetron sputtering rfsuperimposed dc magnetron sputtering target azoal 2o 3 2. These vaporized atoms are then deposited when they condense as a thin film on the substrate to be coated. Magnetron sputtering deposition magnetron sputtered thin.
Deposition conditions for conventional dc magnetron sputter ing and rfsuperimposed dc magnetron sputtering. Thin film deposition physical vapor deposition pvd film is formed by atoms directly transported from source to the substrate through gas phase evaporation thermal evaporation ebeam evaporation sputtering dc sputtering dc magnetron sputtering rf sputtering reactive pvd chemical vapor. Sputtering is just one way to deposit materials, but it is ideal for creating contact layers used in thin film photovoltaics, organic light emitting diodes oled thin films transistors, and many others. Effect of deposition conditions on mechanical stresses and. Check this page for technical resources about sputtering deposition technology. Pvd rf sputtering coating principle magnetron sputter deposition process animation peter chen.
Resputtering is reemission of the deposited material during. Lesker company offers a variety of standalone system components to upgrade your system, facilitate buildyourown systems, andor replace components on existing vacuum systems. Greene 2 1 ghent university, department of solid state sciences, krijgslaan 281 s1, 9000 ghent, belgium 2 materials science and physics departments and the frederick seitz materials research laboratory, university of illinois, urbana, illinois 61801, usa sputter deposition is a widely used technique to deposit thin films on substrates. While any type of film can be rf sputtered, deposition rates are still low. Compared to other deposition techniques, sputtering. When done with direct current dc sputtering, voltages of 35 kv are used. Magnetron sputtering deposition magnetron sputtered thin films. Ito coating by reactive magnetron sputteringcomparison of. Sputtering is a vacuum deposition technique used to deposit thin film of a material onto a surface. Nonconductive materials can not be deposited by dc sputtering since the nonconductive coating on the substrate prevents the electron flow through the anode. The main disadvantage of the basic dc sputtering method is too low density of argon ions producing a low. One solution is to oscillate the cathode voltage like rf sputtering but at a lower frequency 100 khz. Nov 01, 2012 pvd rf sputtering coating principle magnetron sputter deposition process animation peter chen.
Dc or direct current sputtering is a thin film physical vapor deposition pvd coating technique where a target material to be used as the coating is bombarded with ionized gas molecules causing atoms to be sputtered off into the plasma. This involves ejecting material from a target that is a source onto a substrate such as a silicon wafer. Thin film growth through sputtering technique and its. When done with alternating current rf sputtering, frequencies are. Ions strike the target the cathode of the discharge, which is the deposition source. Uniform substrate heating upto 800 deg c are available. Coating methods include physical vapor deposition pvd and one technique is called sputtering.
Radio frequency sputtering an overview sciencedirect topics. The process is performed at 105 torr range pressure where a long. Rf sputtering technique pdf during the last decade the dc and rf sputtering techniques have been used. Radio frequency sputtering can be performed at lower gas pressures 1mtorr than those used for dc nonmagnetron sputtering. Therefore the initial layers of film will be more closely related to the target composition. This page compares rf sputtering vs dc sputtering and mentions difference between rf sputtering and dc sputtering what is sputtering. Both metals require high vacuum sputter coaters for effective deposition. Predefined voltages are applied in the vacuum state before sputtering and after sputtering until vacuum is restored in a.
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